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Single-chip Type with Built-in FET Switching Regulator Series
Output 1.5A or Less High-efficiency Step-down Switching Regulator with Built-in Power MOSFET
BD8312HFN
No.10027ECT04
Description BD8312HFN produces step-down output including 1.2, 1.8, 3.3, or 5 V from 4 batteries, batteries such as Li2cell or Li3cell, etc. or a 5V/12V fixed power supply line. This IC allows easy production of small power supply by a wide range of external constants, and is equipped with an external coil/capacitor downsized by high frequency operation of 1.5 MHz, built-in synchronous rectification SW capable of withstanding 15 V, and flexible phase compensation system on board.
Features 1) Incorporates Pch/Nch synchronous rectification SW capable of withstanding 1.0 A/15V. 2) Incorporates phase compensation device between input and output of Error AMP. 3) Small coils and capacitors to be used by high frequency operation of 1.5MHz 4) Input voltage 3.5 V - 14 V Output current 1.2A(7.4V input, 3.3V output) 0.8A(4.5V input, 3.3V output) 5) Incorporates soft-start function. 6) Incorporates timer latch system short protecting function. 7) As small as 2.9mmx3 mm, SON 8-pin package HSON8
Application For portable equipment like DSC/DVC powered by 4 dry batteries or Li2cell and Li3cell, or general consumer-equipment with 5 V/12 V lines
Operating Conditions (Ta = 25) Parameter Power supply voltage Output voltage
Symbol VCC VOUT
Voltage circuit 3.5 to 14 1.2 to 12
Unit V V
Absolute Maximum Ratings Parameter Maximum applied power voltage Maximum input current Power dissipation Operating temperature range Storage temperature range Junction temperature
Symbol VCC, PVCC Iinmax Pd Topr Tstg Tjmax
Rating 15 1.0 630 25 to +85 55 to +150 +150
Unit V A mW
*1 When used at Ta = 25 or more installed on a 70x70x1.6tmm board, the rating is reduced by 5.04mW/. * These specifications are subject to change without advance notice for modifications and other reasons.
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1/14
2010.06- Rev.C
BD8312HFN
Electrical Characteristics Unless otherwise specified, Ta = 25 , VCC = 7.4 V Parameter Symbol Target Value Min 100 1.38 4.65 0.99 -50 3.2 -1 2.5 -0.3 250 ISTB1 ISTB2 Typ 2.9 200 1.5 5.0 1.00 0 5.3 450 300 0 400 600 30 Max 3.2 300 1.62 5.35 1.01 50 7.4 ()100 600 420 1 11 0.3 700 1 1 900 50 Unit
Technical Note
Conditions
[Low voltage input malfunction preventing circuit] Detection threshold voltage Hysteresis range [Oscillator] Oscillation frequency [Regulator] Output voltage [Error AMP] INV threshold voltage Input bias current Soft-start time [PWM comparator] LX Max Duty [Output] PMOS ON resistance NMOS ON resistance Leak current [STB] STB pin control voltage [Circuit current] Standby current VCC pin
PVCC pin
VUV VUVhy Fosc VREG VINV IINV Tss Dmax RONP RONN Ileak
V mV MHz V V nA msec % m m uA V V k uA uA uA uA
VREG monitor
VCC=12.0V ,
VINV=6.0V
Operation No-operation
VSTBH VSTBL
STB pin pull-down resistance
Circuit current at operation VCC
Circuit current at operation PVCC
VINV=1.2V VINV=1.2V
(1)100% is MAX Duty as behavior of a PWM conparetor. Using in region where High side PMOS is 100% on state as application circuit causes detection of SCP then DC/DC converter stops.
Not designed to be resistant to radiation
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2/14
2010.06- Rev.C
BD8312HFN
Description of Pins Pin No. GND VCC VREG PGND INV STB PVCC Lx 1 2 3 4 5 6 Fig.1 Terminal layout 7 8 Pin Name GND VCC VREG PGND Lx PVCC STB INV
Technical Note
Function Ground terminal Control part power input terminal 5 V output terminal of regulator for internal circuit Power transistor ground terminal Coil connecting terminal DC/DC converter input terminal ON/OFF terminal Error AMP input terminal
Block Diagram
ON/OFF
STB
VREG VCC
PVCC
STBY_IO
DC/DC converter 100% High Duty STOP
5V REG
Reference
VREF
UVLO
OSC 1.0MHz
SCP
OSCx4000 ount
PRE DRIVER
450m
PWM CONTROL Step down
TIMMING CONTROL
LX
VREG
+ + -
PRE DRIVER ERROR_AMP Soft Start
OSCx8000 ount 300m
GND
VREF
PGND
INV
Fig.2 Block diagram
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BD8312HFN
Description of Blocks 1. Reference This block produces ERROR AMP standard voltage. The standard voltage is 1.0 V.
Technical Note
2. 5 V Reg 5 V low saturation regulator for internal analog circuit BD8312HFN is equipped with this regulator for the purpose of protecting the internal circuit from high voltage. Therefore, this output is reduced when VCC is less than 5 V, then PMOS ON resistance increases and Power efficiency and Maximum output current of DC/DC converter decreases in this region. Please see attached data (fig14,15,16,17) about increasing of PMOS ON resistance in this region. 3 UVLO Circuit for preventing low voltage malfunction Prevents malfunction of the internal circuit at activation of the power supply voltage or at low power supply voltage. Monitors VCC pin voltage to turn off all output FET and DC/DC converter output when VCC voltage is lower than 2.9 V, and reset the timer latch of the internal SCP circuit and soft-start circuit. This threshold contains 200 mV hysteresis. 4 SCP Timer latch system short-circuit protection circuit When DC/DC converter is 100% High Duty , the internal SCP circuit starts counting. The internal counter is in synch with OSC, the latch circuit is activated about 2.7 msec after the counter counts about 4000 oscillations to turn off DC/DC converter output. To reset the latch circuit, turn off the STB pin once. Then, turn it on again or turn on the power supply voltage again. 5 OSC Circuit for oscillating sawtooth waves with an operation frequency fixed at 1.5 MHz 6 ERROR AMP Error amplifier for detecting output signals and output PWM control signals The internal standard voltage is set at 1.0 V. A primary phase compensation device of 200 pF, 62 k is built in-between the inverting input terminal and the output terminal of this ERROR AMP. 7 PWM COMP Voltage-pulse width converter for controlling output voltage corresponding to input voltage Comparing the internal SLOPE waveform with the ERROR AMP output voltage, PWM COMP controls the pulse width to the output to the driver.
8 SOFT START Circuit for preventing in-rush current at startup by bringing the output voltage of the DC/DC converter into a soft-start Soft-start time is in synch with the internal OSC, and the output voltage of the DC/DC converter reaches the set voltage after about 8000 oscillations. 9 PRE DRIVER/TIMING CONTROL CMOS inverter circuit for driving the built-in synchronous rectification SW The synchronous rectification OFF time for preventing feedthrough is about 25 nsec.
10 STBY_IO Voltage applied on STB pin (7 pin) to control ON/OFF of IC Turned ON when a voltage of 2.5 V or higher is applied and turned OFF when the terminal is open or 0 V is applied. Incorporates approximately 400 k pull-down resistance. 11 Pch/Nch FET SW Built-in synchronous rectification SW for switching the coil current of the DC/DC converter Incorporates a 450 m PchFET SW capable of withstanding 15 V.and 300 m SW capable of withstanding 15 V. Since the current rating of this FET is 1.0A, it should be used within 1.0A including the DC current and ripple current of the coil.
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BD8312HFN
Reference data Unless otherwise specified, Ta = 25, VCC = 7.4 V
1.02 1.02
Technical Note
5.3
5.2
1.01 1.01
VREG VOLTAGE [V]
INV THRESHOLD [V]
INV THRESHOLD [V]
5.1
1.00
1.00
5.0
4.9
0.99
0.99
4.8
0.98 -40 -20 0 20 40 60 80 100 120 TEMPERATURE []
0.98 0 2 4 6 8 10 12 14
4.7 -40 0 40 80 120
VCC [V]
TEMPERATURE []
Fig.3. INV threshold temperature property
Fig.4. INV threshold power supply property
1.7
Fig.5. VREG output temperature property
8 7 6 5 4 3 2 1 0 0 2 4 6 8 10 12 14
1.7
1.6
1.6
1.5
1.4
1.3
FREQUENCY [ MHz ]
FREQUENCY [MHz]
VREG[V]
1.5
1.4
1.3
-40
0
40
80
120
3
6
9
12
15
VCC [V]
TEMPERATURE []
VCC [V]
Fig.6. VREG output power supply property
500
Fig.7. fosc temperature property
600
Fig.8. fosc voltage property
3.50
Hysteresis width UVLO release voltage
0.25
ID=500mA
500
ID=500mA
Hysteresis VoltageVhys [V] Vhys[V]
3.30
0.20
400
ON RESISTANCE [ m ]
3.10
0.15
300
2.90
0.10
UVLO detection voltage
2.70 0.05
200
ON RESISTANCE [ m]
400
300
200
100
2.50 -40 0 40 80
0.00 120
100 -40 0 40 80 120
0 3 6 9 12 15
TEMPARATURE []
VCC [V]
Environmental temperature Ta [C] Ta []
Fig.9. UVLO threshold temperature property
Fig.10. Nch FET ON resistance temperature property
Fig.11. Nch FET ON resistance power supply property
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5/14
2010.06- Rev.C
BD8312HFN
Technical Note
800
1000
3.0
ID=500mA
800
ID=500mA
SWOUT ON Resistance [ ]
2.5
Ta=85
Ta=25
SWOUT ON Resistance [ ]
PMOS ON Resistance ()
600
2.0
600
400
1.5
400
1.0
Ta=-25
200
200
0.5
0 -40 0 40 80 120
0 3 6 9 12 15
0.0 0.0 1.0 2.0
TEMPARATURE []
VCC [V]
Io [A]
Fig.12. Pch FET ON resistance temperature property
Fig.13. Pch FET ON resistance power supply property
Fig.14.PchFET ON resistance Io property [VCC=3.5V]
3.0
3.0
3.0
2.5
2.5
2.5
PMOS ON Resistance ()
PMOS ON Resistance ()
PMOS ON Resistance ()
2.0
Ta=85
Ta=25
2.0
2.0
Ta=85
1.5
Ta=25
Ta=85
1.5
Ta=25
1.5
1.0
1.0
1.0
Ta=-25
0.5
0.5
Ta=-25
0.5
Ta=-25
0.0 0.0 1.0 2.0
0.0 0.0 1.0 2.0
0.0 0.0 1.0 2.0
Io [A]
Io [A]
Io [A]
Fig.15.PchFET ON resistance Io property [VCC=4.0V]
Fig.16.PchFET ON resistance Io property [VCC=4.5V]
Fig.17.PchFET ON resistance Io property [VCC=5.0V]
2.5
1000
1000
800
800
STB Voltage [V]
2.0
ON
ICC [uA]
600 600
ICC [uA]
400
400
1.5
OFF
1.0 -50 0 50 100 150
200
200
0
-40 0 40 80 120
0 0 2 4 6 8 10 12 14
Ta []
TEMPARATURE []
VCC [V]
Fig.18. STB threshold temperature property
Fig.19. Circuit current temperature property
Fig.20. Circuit current voltage property
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6/14
2010.06- Rev.C
BD8312HFN
Example of Application Input: 4.5 to 10 V, output: 3.3 V / 500mA
Technical Note
VBAT=4.510V
1F GRM188B11A105KA61 Murata
GND
INV
VCC
STB PVCC
ON/OFF 10pF
VREG
1F GRM188B11A105KA61 Murata
3.3V/500mA
10k
200k
PGND
Lx
4.7H 1098AS-4R7MTOKO
51k 10F GRM31CB11A106KA01 Murata 22k
Fig.21 Reference application diagram
Reference application data 1
100
3.35
80
3.33
VCC=7.5V VCC=5.5V
60
OUTPUT VOLTAGE [V]
VCC=4.5V
EFFICIENCY [%]
VCC=7.5V VCC=5.5V
3.31
VCC=4.5V
3.29
40
20
3.27
0 1 10 100 1000
3.25 1 10 100 1000
OUTPUT CURRENT [mA]
OUTPUT CURRENT [mA]
Fig.22 Power conversion efficiency (VOUT = 3.3 V)
Fig.23 Load regulation (VOUT = 3.3 V)
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BD8312HFN
Reference application data 2 (Input 4.5 V, 6.0 V, 8.4 V, 10 V, output 3.3 V
Technical Note
60
180
60 40 20 Gain [dB] 0 Gain -20 -40 -60 100 1000 10000
Phase
40 20 Gain [dB] 0 120 60 Phase [deg] 0
Phase
180 120 60 Phase [deg] Gain [dB] 0 -60 -120 -180
60 40 20 0 -20 -40 -60 100 1000 10000 [Hz] Frequency [Hz] Gain Phase
180 120 60 0 -60 -120 -180 100000 1000000 Phase [deg]
Phase [deg]
Gain
-20 -40 -60 100 1000 10000 [Hz] Frequency [Hz] -60 -120 -180 100000 1000000
100000 1000000
Frequency [Hz] [Hz]
Fig.24 Frequency response 1 (VCC=4.5V, Io=250mA)
60 180 60 40 20 Phase [deg] Gain [dB] 0 -20 -40 -60 100
Fig.25 Frequency response 2 (VCC=6.0V, Io=250mA)
180
Fig.26 Frequency response 3 (VCC=8.4V, Io=250mA)
60 180
Phase
40 20 Gain [dB] 0 120 60 0
Phase
Phase
120 60 Phase [deg]
40 20 Gain [dB] 0
120 60 0
0
Gain
-20 -40 -60 100 1000 10000 100000 -60 -120 -180 1000000
Gain
Gain
-20 -40 -60 100 1000 10000 100000 [Hz] Frequency [Hz] -60 -120 -180 1000000
-60 -120 -180
1000
10000
100000
1000000
Frequency[Hz] [Hz]
Frequency [Hz] [Hz]
Fig.27 Frequency response 4 (VCC=10V, Io=250mA)
60
Phase
Fig.28 Frequency response 5 (VCC=4.5V, Io=500mA)
60 40 20 180
Fig.29 Frequency response 6 (VCC=6.0V, Io=500mA)
180 120 60 Phase [deg]
Gain [dB]
40 20 Gain [dB] 0
Gain
Phase
120 60 0 -60 -120 -180 Phase [deg]
0 -60 -120 -180 100 1000 10000 100000 1000000
0 -20 -40 -60 100 1000
Gain
-20 -40 -60
10000
100000
1000000
Frequency[Hz] [Hz]
Frequency [Hz] [Hz]
Fig.30 Frequency response 7 (VCC=8.4V, Io=500mA)
Fig.31 Frequency response 8 (VCC=10V, Io=500mA)
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BD8312HFN
Reference board pattern
Technical Note
VOUT
Lx VBAT
GND
The radiation plate on the rear should be a GND flat surface of low impedance in common with the PGND flat surface. It is recommended to install a GND pin in another system as shown in the drawing without connecting it directly to this PNGD. Produce as wide a pattern as possible for the VBAT, Lx and PGND lines in which large current flows. Selection of Part for Applications (1) Inductor A shielded inductor that satisfies the current rating (current value, Ipecac as shown in the drawing below) and has a low DCR (direct resistance component) is recommended. Inductor values affect inductor ripple current, which will cause output ripple. Ripple current can be reduced as the coil L value becomes larger and the switching frequency becomes higher. Ipeak =Iout IL/2 [A] 1 x f [A] (2) (1)
IL
Fig.32 Inductor current
IL=
VinVout L
x
Vout Vin
(: Efficiency, IL: Output ripple current, f: Switching frequency) As a guide, inductor ripple current should be set at about 20 to 50% of the maximum input current. *Current over the coil rating flowing in the coil brings the coil into magnetic saturation, which may lead to lower efficiency or output oscillation. Select an inductor with an adequate margin so that the peak current does not exceed the rated current of the coil. (2) Output capacitor A ceramic capacitor with low ESR is recommended for output in order to reduce output ripple. There must be an adequate margin between the maximum rating and output voltage of the capacitor, taking the DC bias property into consideration. Output ripple voltage is acquired by the following equation. ILxRESR [V] (3) 2xfxCo Setting must be performed so that output ripple is within the allowable ripple voltage. Vpp=ILx 1
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9/14
2010.06- Rev.C
BD8312HFN
(3) Output voltage setting The internal standard voltage of the ERROR AMP is 1.0 V.
VOUT ERROR AMP INV R2 VREF 1.0V
Vo=
Technical Note
Output voltage is acquired by Equation (4).
R1
(R1+R2) R2
x1.0 [V] (4)
Fig.33 Setting of voltage feedback resistance (4) DC/DC converter frequency response adjustment system Condition for stable application The condition for feedback system stability under negative feedback is that the phase delay is 135 or less when gain is 1 (0dB). Since DC/DC converter application is sampled according to the switching frequency, the bandwidth GBW of the whole system (frequency at which gain is 0 dB) must be controlled to be equal to or lower than 1/10 of the switching frequency. In summary, the conditions necessary for the DC/DC converter are: - Phase delay must be 135or lower when gain is 1 (0 dB). - Bandwidth GBW (frequency when gain is 0 dB) must be equal to or lower than 1/10 of the switching frequency. To satisfy those two points, R1, R2, R3, DS and RS in Fig. 34 should be set as follows. [1] R1, R2, R3 BD8313HFN incorporates phase compensation devices of R4=62k and C2=200pF. These C2 and R1, R2, and R3 valuesdecide the primary pole that determines the bandwidth of DC/DC converter. Primary pole point frequency 1 2 Ax( DC/DC converter DC Gain
DC Gain =Ax 1 B x
VOUT R1 Cs Rs R2 R3 FB Inside of IC R4 C2
fp=
R1xR2 +R3)xC2 R1+R2
(1) Fig.34 Example of phase compensation setting A: Error AMP Gain 5 About 100dB = 10 B: Oscillator amplification = 0.5 VIN: Input voltage Output voltage VOUT:
VIN VO
(2)
By Equations (1) and (2), the frequency fsw of point 0 dB under limitation of the bandwidth of the DC gain at the primary pole point is as shown below. 1
(R1R2) 2C2x( +R3 ) (R1+R2)
fSW = fpxDC Gain =
x
1 B
x
VIN VO
(3)
It is recommended that fsw should be approx.10 kHz. When load response is difficult, it may be set at approx. 20 kHz. By Equation (3), R1 and R2, which determine the voltage value, will be in the order of several hundred k. If an appropriate resistance value is not available since the resistance is so high and routing may cause noise, the use of R3 enables easy setting.
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BD8312HFN
[2] Cs and Rs setting For DC/DC converter, equation.
Technical Note
the 2nd dimension pole point is caused by the coil and capacitor as expressed by the following
fLC=
1 2(LC)
(4)
This secondary pole causes a phase rotation of 180. To secure the stability of the system, put a zero point in 2 places to perform compensation. Zero point by built-in CR fZ1= 1 2R4C2 1 2(R1+R3)CS = 13kHz (5)
Zero point by Cs
fZ1=
(6)
Setting fZ2 to be half to 2 times a frequency as large as fLC provides an appropriate phase margin. It is desirable to set Rs at about 1/20 of (R1+R3) to cancel any phase boosting at high frequencies. Those pole points are summarized in the figure below. The actual frequency property is different from the ideal calculation because of part constants. If possible, check the phase margin with a frequency analyzer or network analyzer. Otherwise, check for the presence or absence of ringing by load response waveform and also check for the presence or absence of oscillation under a load of an adequate margin.
(5) (6)
(3) (4)
Fig.35 Example of DC/DC converter frequency property Measured with FRA5097 by NF Corporation
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11/14
2010.06- Rev.C
BD8312HFN
I/O Equivalence Circuit
Technical Note
STB
VCC
INV
VCC VREG
STB
INV
Lx, PGND, PVCC
VREG
VCC
PVCC
VCC
VREG
Lx
PGND
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BD8312HFN
Technical Note
Notes for use 1) Absolute Maximum Rating We dedicate much attention to the quality control of these products, however the possibility of deterioration or destruction exists if the impressed voltage, operating temperature range, etc., exceed the absolute maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. If a special mode exceeding the absolute maximum rating is expected, please review matters and provide physical safety means such as fuses, etc. 2) GND Potential Keep the potential of the GND pin below the minimum potential at all times. 3) Thermal Design Work out the thermal design with sufficient margin taking power dissipation (Pd) in the actual operation condition into account. 4) Short Circuit between Pins and Incorrect Mounting Attention to IC direction or displacement is required when installing the IC on a PCB. If the IC is installed in the wrong way, it may break. Also, the threat of destruction from short-circuits exists if foreign matter invades between outputs or the output and GND of the power supply. 5) Operation under Strong Electromagnetic Field Be careful of possible malfunctions under strong electromagnetic fields. 6) Common Impedance When providing a power supply and GND wirings, show sufficient consideration for lowering common impedance and reducing ripple (i.e., using thick short wiring, cutting ripple down by LC, etc.) as much as you can. 7) Thermal Protection Circuit (TSD Circuit) This IC contains a thermal protection circuit (TSD circuit). The TSD circuit serves to shut off the IC from thermal runaway and does not aim to protect or assure operation of the IC itself. Therefore, do not use the TSD circuit for continuous use or operation after the circuit has tripped. 8) Rush Current at the Time of Power Activation Be careful of the power supply coupling capacity and the width of the power supply and GND pattern wiring and routing since rush current flows instantaneously at the time of power activation in the case of CMOS IC or ICs with multiple power supplies.
9) IC Terminal Input
This is a monolithic IC and has P+ isolation and a P substrate for element isolation between each element. P-N junctions are formed and various parasitic elements are configured using these P layers and N layers of the individual elements. For example, if a resistor and transistor are connected to a terminal as shown on Fig.36: The P-N junction operates as a parasitic diode when GND > (Terminal A) in the case of a resistor or when GND > (Pin B) in the case of a transistor (NPN) Also, a parasitic NPN transistor operates using the N layer of another element adjacent to the previous diode in the case of a transistor (NPN) when GND > (Pin B). The parasitic element consequently rises under the potential relationship because of the IC's structure. The parasitic element pulls interference that could cause malfunctions or destruction out of the circuit. Therefore, use caution to avoid the operation of parasitic elements caused by applying voltage to an input terminal lower than the GND (P board), etc. Resistor (Pin A) (Pin B) Transistor (NPN)

C
B
E GND
N P N P N P Substrate P N P N
N GND
Parasitic Element
Parasitic Element
P Substrate GND
Parasitic Element
Fig.36 Example of simple structure of Bipolar IC
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2010.06- Rev.C

P
P
(Pin A)
BD8312HFN
Ordering part number
Technical Note
B
D
8
Part No.
3
1
2
H
F
N
-
T
R
Part No.
Package HFN:HSON8
Packaging and forming specification TR: Embossed tape and reel
HSON8

2.90.1 (MAX 3.1 include BURR)
(0.2)
(2.2)
(0.05)
Tape Quantity
Embossed carrier tape 3000pcs TR
The direction is the 1pin of product is at the upper right when you hold
0.475
3.0 0.2 2.8 0.1
8 765
(0.15)
(0.3)
5678
(0.45)
(0.2) (1.8)
Direction of feed
+0.1 0.13 -0.05
( reel on the left hand and you pull out the tape on the right hand
1pin
)
1234
4321
1PIN MARK
0.6MAX
S
+0.03 0.02 -0.02
0.1 0.65 0.320.1
S
0.08
M
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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14/14
2010.06- Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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